Originally posted by dpaul
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I know MSS60 uses EWS4 and MSS65 uses EWS3, and there are some component changes due to that (EWS3 uses unidirectional communication while EWS4 uses bidirectional). EWS4 is supposed to be able to fall back to the CAN-bus though so that in itself might not be a big issue
What I don't know is if there are hardware differences for things like the ionic module or if it's just purely software.
Really wish we could do something about the BDM access short of replacing the whole CPU.
Edit: In the interest of open information sharing, added some highish resolution images of both sides of the MSS65 board. Can zoom in on any relevant bits once when I see some MSS60 bits to compare
Edit2: Of course the forum resized the pictures.
Edit 3: Here's a BMW press photo of the MSS60. Clearly has more components, but it's also clearly a dev board based on the populated BDM/JTAG headers. So it's hard to say how much is necessary without seeing a production board.
Edit 4: Attached the differences I could spot with the chips identified. I think it's safe to say the ethernet is not needed on a production board. Hopefully all that extra RAM was primarily for debugging as well. The other stuff could go either way. Extra CAN tranceivers could be for debugging or could be for some E9x specific equipment. For the LIN tranceivers, at least one of them should be for EWS4 comms. Not sure about the other. Oddly they used 2 different brands on the same board. Don't know about the OP AMP.

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